Omnivision OG12S10 CMOS image sensor

OMNIVISION has launched the OG12S10 12-megapixel (MP) backside illuminated (BSI) global shutter (GS) CMOS image sensor for factory automation and intelligent transportation systems (ITS). It features a large 3.45-micron (µm) pixel, providing high quantum efficiency (QE). It also supports an ultra-short exposure time of 1 microsecond (µs) for accuracy control in high-speed motion scenarios.

The OG12S10 PureCel Plus-S pixel GS sensor has on-chip dual conversion gain (DCG) high dynamic range (HDR) and features a 4096 x 3072 resolution. Nyxel near-infrared (NIR) technology enables clear image capture with high pixel sensitivity and no motion artefacts. The imaging performance of the 12MP GS sensor is further enhanced by its 12-bit ADC (analog-to-digital conversion). With a maximum of 75 frames per second (fps), the sensor is designed to capture fast-moving objects.

The OG12S10 GS sensor comes in a ceramic land grid array (CLGA) package and will be available for sampling in November 2026; it will be in mass production in Q4 2026.