Webinar: PCB Design for Space Applications

Developing a reliable PCB for use in space requires a unique set of design and layout challenges. With 2000-pin GHz-speed FPGAs, X-band, GSPS ADCs/DACs and low-voltage, high-current power distribution, how do you ensure your satellite/spacecraft PCB will function in the vacuum of space? What criteria should you to use when selecting a dielectric? How do you develop a stack which delivers the necessary performance, minimises EMI and maximises heatsinking? How should you de-rate the current-carrying capacity of traces to ensure reliability? Should you use a solder mask? What are the formal PA standards to sign-off space-grade PCBs?

Dr Rajan Bedi, CEO of Spacechips Ltd, will be presenting a 45-minute webinar on PCB Design for Space Applications on Monday, 15 February at 17:00 Sydney time. There will be a Q&A session afterwards for you to ask questions. The webinar is suitable for design engineers, system integrators, project managers, QA, component suppliers, system engineers, OEMs, agencies, government and FAEs. To register, please contact: events@spacechipsllc.com