Microlog, is a miniature data logger that weighs less than 10 g and has a 4 mb memory, a 16 byte microprocessor and satellite and mobile phone technology packed into one third of the size of a matchbox. It has been developed by a father and son team at the University of Newcastle upon Tyne's Stephenson Centre.

Scientist at the University of Newcastle upon Tyne have created a new gold nitride material which could save the electronics industry millions each year.

Philips Electronics will participate as a core partner in IMEC's sub 45 nm research programs. IMEC is an independent semiconductor research organisation specialising in the development of semiconductor process technologies at geometries of 45 nm and beyond. Research will start on 200 mm and gradually transition to 300 mm.

Engineers have designed a new diode that transmits more electricity - conducting 150,000 A per square centimetre. Unlike other diodes in its class, called tunnel diodes, the new diode is compatible with silicon, so manufacturers could build it into mainstream electronic devices such as mobile phone and computers.

If all goes as planned, two rovers named Spirit and Opportunity will explore the surface of Mars next year, gathering geologic information and beaming the results back to Earth. However, the environment is so extreme that the rovers will be equipped with heaters to keep the electronic gear warm enough to operate properly as temperatures can dip to -120 degrees C. Futures space probes will involve even more extreme environments, with temperatures as high as 460 degrees Celsius on Venus and as low as -180 Celsius on Titan, the largest moon of Saturn.

Maser Technology has been appointed as distributor of Belden's range of electronic control, industrial and instrumentation cables. Maser will assist companies looking for specialist cables for automation and robotics, PLC control, manufacturing, mining, SCADA and security applications.

Tekelek has launched a new services division to provide design and manufacturing support to industry in the United States.

While silicon is still the mainstay of the industry, circuit designers also would like to put materials like gallium nitride and silicon carbide into wider use.

Researchers at UMR and Motorola are developing 3D switches and tiny fuel cells to improve the reception quality and extend the operating time for wireless communications and other wireless sensing devices.

The Storage Networking Industry Association (SNIA) has approved the formation of SNIA (Australia and New Zealand) Ltd as a regional affiliate. The organisation will develop educational and marketing programs to promote the use of storage networking solutions to IT professionals via the working together of vendors, developers and integrators.

Intel Corporation has outline plans for next-generation wireless mobility products designed to improve productivity and drive new growth opportunities. The disclosures were made at the Intel Developer Forum and include enhancements for the next Intel Pentium M processor, code-named Dothan; a computing platform based on Intel Centrino mobile technology, code-named Sonoma; and technology for upcoming Intel XScale technology based processors for mobile phones and PDAs, code-named Bulverde.

Researchers at Princeton envision mass-produced rolls of material that converts sunlight to electricity, using a new technique for making solar cells.

Samtec and Teraspeed Consulting Group have joined forces to bring to market the next generation of high-speed interconnects, flex circuits and sub system and to develop design tools to maximise users performance in end systems. Teraspeed is also providing training and supportservices.

The Electronics Industry Action Agenda report has been released by the Hon Richard Alston, Minister for Communication, IT and the Arts, and the Hon Ian Macfarland, Minister for Industry, Tourism and Resources. It was presented at the 9th World Electronic Forum at Australian Technology Park, Sydney and AEEMA has been allocated a key role in the implementation of these recommendations.

Epson is developing a ferroelectric material for ferroelectric random-access memory (FeRAM), a next generation type of memory. The new material has been tentatively named PZTN.