Mouser MultiSIM BLUE Premium circuit design tool
28 July, 2016 | Mouser Electronics (Hong Kong) LtdMouser Electronics has announced MultiSIM BLUE Premium, the latest release of the MultiSIM BLUE circuit design tool. Powered by National Instruments, the product offers unlimited components within the schematic and integrated design capabilities.
Genrad 1433F decade resistor
27 July, 2016 | TechRentalsThe Genrad 1433F decade resistance box is designed to check the accuracy of devices that measure resistance.
NanoFocus μsurf mobile optical 3D surface measurement system
27 July, 2016 | SciTech Pty LtdThe portable optical 3D surface measurement system μsurf mobile, by NanoFocus, is suitable for portable roughness measurements, analyses of 3D structures, measurement of microgeometry, topography, layer thickness and volume.
STMicroelectronics STSPIN motor drivers
26 July, 2016 | STMicroelectronics Pty LtdSTMicroelectronics' line of STSPIN single-chip motor drivers is said to meet the needs of the most demanding portable and wearable applications.
Spectrum Illumination machine vision lighting
26 July, 2016 | SciTech Pty LtdSpectrum Illumination is a supplier of high-output LED lights for the machine vision industry. The company's product lines include ring lights, spotlights, dome lights, diffused axial lights, linear lights, oxy lights, washdown lights and backlights.
Robustel GoRugged R2000 Dual 4G LTE router
25 July, 2016 | Glyn LtdThe Robustel GoRugged R2000 Dual is a rugged cellular router offering state-of-the-art mobile connectivity for machine-to-machine (M2M) applications. The router will primarily operate in 4G LTE with 3G/2G fallback and has RCM certification for Australia.
VIA Technologies boards and modules
25 July, 2016 | Mouser Electronics (Hong Kong) LtdThe VIA product line consists of a series of powerful, highly integrated boards and modules that enable the rapid development of embedded system designs based on industry-standard PicoITX and ETX form factors.
Molex USB-C connectors and cable assemblies
24 July, 2016 | RSMolex's latest USB-C connectors and cable assemblies target a wide range of electronics applications in consumer markets as well as automation and control systems, automotive and telecoms and data communications sectors.
Exodus Advanced Communications AMP1064 amplifier module
23 July, 2016 | ASD Technology Pty LtdThe AMP1064 amplifier module, from Exodus Advanced Communications, covers the entire instantaneous 20–6000 MHz frequency range at 20 W CW minimum and 25 W CW typical, with flatness of less than 4 dB peak to peak.
Avalue HPC-BYT embedded system
23 July, 2016 | AvalueAvalue Technology has introduced the HPC-BYT embedded system. The machine features the Intel Bay Trail platform to meet the requirements of IoT-relevant applications, include good video and graphics performance, high-speed data processing, low power and low-profile design.
HARTING Han ES Press series rapid termination devices
22 July, 2016 | RSThe Han ES Press series, an expansion of Harting's Han E series, offers a connector termination solution for a variety of applications in machinery and robotics, energy, transportation, automation, broadcast and entertainment.
Acromag BusWorks Models XT1530 and XT1540 ethernet I/O modules
22 July, 2016 | Metromatics Pty LtdAcromag has expanded its BusWorks XT Series of ethernet I/O modules to include models with multiple I/O functionality.
Crystal Group RE1312 Rugged Embedded Computer
21 July, 2016 | Metromatics Pty LtdCrystal Group has launched the RE1312 Rugged Embedded Computer, a lightweight computer with the capability to bring powerful computer processing to a variety of transportation platform applications.
Vishay HOTcaps series multilayer ceramic capacitors
21 July, 2016 | element14Vishay's high-operating-temperature, radial-leaded, multilayer ceramic capacitors (MLCCs) for automotive applications are now available.
Molex Nano-Pitch I/O interconnect system
20 July, 2016 | Mouser Electronics (Hong Kong) LtdThe Molex Nano-Pitch I/O interconnect system benefits high-performance applications by delivering robust, small-form-factor, high-speed and multiprotocol interconnects suitable for both internal and external solutions.
