Design > Semiconductors

Development of novel conduction control technique for graphene

23 November, 2012

Researchers have developed a novel technique for controlling the electrical conductivity of graphene.


Microelectronic circuit fabrication

16 November, 2012

A technique for measuring the stress in chips during production is now available. The resulting information could enable miniature but robust semiconductor devices.


Carbon devices are poised to replace and outperform silicon

16 November, 2012

Ten thousand working transistors placed on a single chip using standard semiconductor processes.


Ultrafast optical amplifier

11 October, 2012

Silicon and erbium-doped material offers high optical bandwidth and amplification properties.


Less expensive nanolithography technique

04 September, 2012

Researchers have developed a nanolithography technique that is claimed to be less expensive than other approaches and can be used to create technologies with biomedical applications.


Graphene challenges future of silicon

20 May, 2010

A collaborative research project claims to have brought the world a step closer to producing a new material on which future nanotechnology could be based.


Semiconductor income may decline by 22%

12 June, 2009

Worldwide semiconductor revenue is forecast to reach $252 billion in 2009, a 22.4% decline from 2008 revenue of $286.5 billion, according to the latest projections by Gartner.


Unmasking semiconductors

04 March, 2009

European researchers have developed a solution to ‘mask-less’ semiconductor lithography which claims to reduce the costs and production times associated with low-volume device manufacture and prototyping.


Mouser Electronics and Leadis Technology global distribution

27 February, 2009

Mouser Electronics has signed a global distribution agreement with Leadis Technology, a fabless semiconductor company that specialises in designing and developing analog and mixed-signal semiconductors.


IDT and Digi-Key sign distribution deal

16 January, 2009

IDT (Integrated Device Technology) and Digi-Key have signed a distribution agreement.


Measuring the toughness of thin insulating films

08 January, 2009

Researchers have developed a technique that could improve the reliability and manufacturability of ICs.


German firm adopts Australian design

10 December, 2008

Heidelberg Instruments has selected Altium as its electronics design standard.


Contactless agreement

24 November, 2008

NXP, the independent semiconductor company founded by Philips and Renesas Technology, has expanded the licensing agreement on NXP's MiFare technology.


Conductive ink deal

11 July, 2008

Sigma-Aldrich has signed an agreement with Plextronics to distribute its organic semiconductors and conductive inks.


Optical chip factory opened in Germany

15 April, 2008

The last section of OSRAM’s new semiconductor plant has been opened in Regensburg, Germany, by Martin Goetzeler, OSRAM CEO, Dr Rüdiger Müller, CEO of OSRAM Opto Semiconductors and Regensburg Mayor Hans Schaidinger.


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