BOPLA BoLink IoT sensor enclosure series

Wednesday, 16 January, 2019 | Supplied by: ERNTEC Pty Ltd


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The Internet of Things (IoT) requires a large number of electronic devices which record, collect, evaluate and relay data. These devices range from sensors to communication nodes right up to gateways to the internet. With the BoLink series of sensor enclosures, BOPLA is now offering enclosure series for every type of IoT device.

The compact BoLink IoT sensor enclosure is made of flame-resistant PC UL94 V-0. Measuring 70 x 42 mm, it provides space for a sensor, wireless module and a power supply. Due to its moulded-on insertion opening, it is suitable for the integration of a pressure compensation element, including for outdoor use. Depending on the type of power requirement needed for wireless technology, BOPLA supplies the small plastic enclosure in three heights: 15 mm for a button cell, 22 mm for three AAA batteries and 26 mm for a CR 14250 lithium battery.

By using a basic mould shape, and various inserts for moulding different enclosure heights, wall brackets and screwing options, BOPLA can create a total of 18 variants of the basic IOT type. Each height is available in three different versions: with wall fitting and front access, which makes replacing the battery easy; with wall mounting and a rear screwing system to provide a clean, attractive look; and with a rear screwing system and without mounting brackets.

In addition, every variant of the enclosure is available with two IP protection classes: without a seal (IP40) and with a seal (IP65). If necessary, the installation height of the electronics compartment can be increased by 1.5 mm with the aid of a seal.

Online: www.erntec.net
Phone: 03 9756 4000
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