BOPLA Intertego and Filotec aluminium enclosures

Friday, 23 December, 2016 | Supplied by: ERNTEC Pty Ltd


Intertego filotec

With their aluminium profile technology, BOPLA’s Intertego and Filotec enclosure series have high levels of modularity and sturdiness.

BOPLA has added the 4U height (188.75 mm) to the Intertego enclosure series, with depth and width that can be adapted to meet individual requirements. The base and lid sheets are made of aluminium and the diecast corners are made of a zinc alloy. The series provides good electromagnetic compatibility (EMC), and accessories make it possible to increase the screening performance.

The enclosures are designed for the installation of 19″ components. In addition to use as a design-orientated desktop enclosure, it can be used as a 19″ chassis. The series is supplied in graphite grey, but special colours are available on request. The protection class depends on the cover plates which are fitted — with ventilation openings it is about IP20, and about IP40 for the closed version.

The Filotec enclosures are mainly used for interface modules, for industrial PCs and in the electronic power supply sector. The range comprises over 100 enclosures in six product series. Aluminium profile enclosures are available in several different heights and lengths, as are profile variants. Depending on the model, the enclosures are fitted with a 1 or 1.5 mm membrane keypad area. Variants with an integrated heat sink and with moulded-on wall brackets are also available.

All Filotec variants provide protection class IP40 and use the same material. The anodised aluminium in the enclosures has a simple but high-quality appearance. BOPLA has now added the F 1632-xxx size to the range, designed for users who want to install large circuit boards in the enclosures. The internal dimensions are designed to take a 100 x 160 mm Euro card with a horizontal format.

Online: www.erntec.net
Phone: 03 9756 4000
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