AMD approval for heat sink
Molex has receive approval for its CoolFin heat sink from AMD for the next generation 64 bit processor, the Athlon 64. As the result of meeting strict thermal resistance and other design requirements, Molex is one of a few vendors to receive AMD's approval on this new platform.
The heat sink line features stamped fin technology. The fins are individually stamped to a specified geometry and linked together for stability. Stamped fin designs can be virtually any shape or thickness, offering optimal design flexibility.
For more information please go to http://www.molex.com/heatsink.html/
Sticking materials together without glue or tape — just electricity
Researchers have used a small voltage to bind hard and soft materials to each other, without...
Microwave photonics chip uses optics for analog computation
Researchers have developed a microwave photonic device that can process analog electronic signals...
Nanothin memory chips manufactured with 2D printing
Engineers from the University of Sydney have developed a 2D printing process using liquid metals...