AMD approval for heat sink
Molex has receive approval for its CoolFin heat sink from AMD for the next generation 64 bit processor, the Athlon 64. As the result of meeting strict thermal resistance and other design requirements, Molex is one of a few vendors to receive AMD's approval on this new platform.
The heat sink line features stamped fin technology. The fins are individually stamped to a specified geometry and linked together for stability. Stamped fin designs can be virtually any shape or thickness, offering optimal design flexibility.
For more information please go to http://www.molex.com/heatsink.html/
Turning waste wood into biodegradable PCBs
Researchers have developed fully biodegradable printed circuit boards made from lignocellulose, a...
Light-speed analog computing — the future of technology?
Aussie researchers have designed an analog computer circuit which uses radio and microwave...
Scientists build fluid-based chip with brain-like memory
Researchers at Monash University have developed a nanofluidic chip that mimics neural pathways in...


