AMD approval for heat sink
Molex has receive approval for its CoolFin heat sink from AMD for the next generation 64 bit processor, the Athlon 64. As the result of meeting strict thermal resistance and other design requirements, Molex is one of a few vendors to receive AMD's approval on this new platform.
The heat sink line features stamped fin technology. The fins are individually stamped to a specified geometry and linked together for stability. Stamped fin designs can be virtually any shape or thickness, offering optimal design flexibility.
For more information please go to http://www.molex.com/heatsink.html/
Research identifies hidden network latency bottlenecks
Researchers have identified hidden network latency bottlenecks, revealing where delays occur and...
Optical isolators integrated on silicon photonics chips
A new laser-annealing process integrates optical isolators directly onto silicon photonics chips,...
Laser-patterned polymers enable novel surfaces for electronics
A low-power laser process transforms sulfur-based polymers into functional reflective and...

