AMD approval for heat sink
Molex has receive approval for its CoolFin heat sink from AMD for the next generation 64 bit processor, the Athlon 64. As the result of meeting strict thermal resistance and other design requirements, Molex is one of a few vendors to receive AMD's approval on this new platform.
The heat sink line features stamped fin technology. The fins are individually stamped to a specified geometry and linked together for stability. Stamped fin designs can be virtually any shape or thickness, offering optimal design flexibility.
For more information please go to http://www.molex.com/heatsink.html/
Unlocking the potential of graphene for future electronics
Researchers have observed the Floquet effect in graphene, thereby increasing its flexibility and...
Digital to analog in one smooth step
Researchers have created an electro-optic digital-to-analog converter that bridges electronic and...
Hybrid photonic-terahertz chip enhances communications
Researchers at EPFL have engineered a chip that can convert between electromagnetic pulses in the...
