congatec conga-IC175 Thin Mini-ITX thin industrial-grade motherboard

The congatec conga-IC175 Thin Mini-ITX thin industrial-grade motherboard features the 7th Gen Intel Core U (Kaby Lake) processors designed for IoT connected devices. The boards are suitable for space-constrained, high-performance, low-power IoT designs.

They also offer comprehensive IoT support including a SIM card socket for 3G/4G or narrowband connectivity.

The low-profile design of the industrial motherboard family makes it suitable for slim system designs such as industrial GUIs/HMIs, digital signage systems, point-of-sale terminals and medical tablets. The boards excel through the option of ultrafast Intel Optane memory via M.2 connector, enabling fast system boots, application starts, video recording and processing, and software updates. The boards support hyper-threading, which turns the dual-core design into a 4-in-1 system when utilising the RTS real-time hypervisor.

The motherboards can be universally employed in all the various embedded and IoT applications, as the low-power versions of the high-end 64-bit Intel Core processors offer a highly configurable thermal design power (TDP) of 15 W, with the flexibility to scale dissipation from 7.5 to 25 W cTDP for balance of power and performance.