CUI extruded and stamped aluminium heat sinks

CUI’s Thermal Management Group has announced an expansion to its existing portfolio of Peltier devices and DC fans with the addition of a heat sink product line.

The aluminium heat sinks, available in both extruded and stamped versions, are compatible with TO‑218, TO‑220, TO‑252 and TO‑263 transistor packages. Designed to improve the heat dissipation of low- and high-power board-level applications, the stampings and extrusions are conveniently measured under four conditions for thermal resistance, making it easy to select the optimal heat sink for natural convection or forced air cooled systems.

The extruded and stamped heat sinks offer tin-plated or black anodised material finishes and are available with or without solder pins in vertical or horizontal orientations. Thermal resistances measured at 75°C ΔT in natural convection environments are as low as 4.49°C/W, while power dissipation ratings measure up to 16.7 W at 75°C ΔT in natural convection.

CUI also offers a range of custom heat sink capabilities. With alternative production methods such as forging and die casting as well as extrusions and stampings, the company can create virtually any shape or profile to fit specific design needs. A variety of additional materials and finishes are available, including clear and colour anodisation, chromate powder coating, and nickel or zinc plating. Hole punching for custom mounting patterns is also an option.