DuPont Electronics & Imaging In-Mold Electronic materials

DuPont Electronics & Imaging has launched its second generation of In-Mold Electronic (IME) materials with key advancements in its electrically conductive adhesive, protection encapsulant and crossover dielectric.

IME technology enables functions such as touch controls and lighting to be directly embedded inside of plastic parts by printing circuits onto plastic sheets, which are then thermoformed and injection moulded. This allows product engineers to reduce weight while increasing design aesthetics and functionality in everything from car dashboards to home appliances, using fewer parts and manufacturing steps.

The second-generation electrically conductive adhesive is said to be more flexible than epoxy-based systems, resulting in better adhesion after forming. The IME-specific adhesive is purposely designed to flex during forming, eliminating the delamination that occurs in more brittle, traditional systems. It is suitable for attaching LEDs and microcircuit controllers.

The protection encapsulant offers toughness for use as tie-coat and top seal, plus good abrasion performance and environmental ageing. The product stands up to the heat of thermoforming and resists washout in moulding.

Finally, the crossover dielectric is said to cut the number of layers required by half. This results in shorter processing time while achieving electrical isolation and high breakdown voltage.

DuPont also offers a conductor and transparent conductor, as well as a compatible carbon layer as part of its full portfolio.