DuPont Pyralux HP laminate adhesive system

In today’s high-performance electronic devices, data consumption continues to stretch the limits across a variety of end-market segments. High-speed signal transfer across the network creates numerous environments where signal integrity is often diminished, resulting in issues for end users. To improve the performance of electronic devices, DuPont developed the epoxy-based Pyralux HP laminate adhesive system, featuring good insertion loss performance, functionality and processing.

The system possesses robust processability while maintaining good electrical performance to optimise signal integrity in demanding and extreme environment PCB applications. It was specifically designed for original equipment manufacturers (OEMs) and printed circuit board (PCB) manufacturers to address high-performance and high-reliability applications in markets such as telecommunications, networking, medical, industrial, military and aerospace.

The IPC-certified product is available as a sheet adhesive or as a coverlay that is suitable for a wide variety of multilayer-flex and rigid-flex applications. It enables processing at low temperatures, providing PCB designers and producers with an expanded range of applications they can support when using the system.