Rehm Thermal Systems Condenso XC Batch Vacuum Reflow System

The Condenso XC Batch Vacuum Reflow System operates on the perfluorpolyether injection volume control principle. A defined quantity of fluid (usually perfluorpolyether) is vaporised during operation in the process chamber, which is hermetically sealed by means of a bulkhead.

The vapour allows for effective heat transfer to the PCBs due to the release of heat during condensation. The temperature of the medium remains constant. In addition to this, the medium’s boiling point limits the maximum soldering temperature so that the PCBs cannot be damaged due to overheating.

This, as well as the ability to control the volume of injected liquid and intermediate exhaust of the vapour, also makes it possible to precisely adjust the temperature/reflow profile of the PCB. Reproducible soldering results are thus ensured, which increases process stability.

The product has a controllable vacuum process, meaning pre-vacuum stages and vacuum after soldering are possible. There is no product movement during soldering, no Galden loss and active Galden filtering. Featuring manual loading from the front side, the system is suitable for high-technology, large thermal mass, difficult soldering applications.