Würth Elektronik WE-SMGS solderable seal

Würth Elektronik’s WE-SMGS is a solderable seal for surface mounting. The product consists of a temperature-resistant foam material, which combines the conductive seal with high elasticity. After compression, the seal returns to its original shape. The layer surrounding the heat-resistant foam is made of copper weave with tinning. It facilitates the soldering process in the reflow oven.

The seal can be used to establish contact between the PCB ground and metallic housing or other external metallic elements. It can also be used for low-resistance HF connections between the grounding points of two superimposed PCBs. These elements are designed for the pick-and-place/reflow process and thus represent an alternative to WE-SECF contact fingers.

The product is available in various heights from 2.5 to 15 mm.