$6.9m funding to boost Aussie semiconductor packaging tech

The Australian Government has announced $6.9 million in funding to support manufacturing-focused projects, including a semiconductor packaging tool and printed solar technology, as part of its Industry Growth Program.

The Program supports innovative and high-growth-potential small and medium enterprises with advice and matched grant funding, to help them commercialise and expand.

Projects are required to align with the priority areas under the National Reconstruction Fund; they must also help to strengthen Australia’s future manufacturing capability.

The funding has been awarded to several high-impact technology developers advancing semiconductor packaging and next-generation photovoltaics. Spark3D has secured $4.8 million to commercialise Achyon, its advanced semiconductor packaging platform. The technology is designed to address increasing performance, thermal management and integration demands in modern electronic systems across consumer electronics, automotive and computing applications. The funding will support the transition from development to scalable manufacturing, positioning the platform for global market deployment.

Kardinia Energy has also received $2.1 million to accelerate commercialisation of its printed photovoltaic technology. The investment will enable the establishment of a pilot-scale manufacturing facility to validate production processes and supply-chain readiness. Unlike conventional rigid silicon-based panels, the company’s printed solar technology utilises flexible substrates, enabling lightweight form factors and improved end-of-life recyclability.

A full list of successful applicants can be found here, along with further information about grant opportunities.

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