Sensor labels signing
Bemis has signed a joint development agreement with Thin Film Electronics ASA to develop a Bemis intelligent packaging platform.
The agreement will accelerate the commercial development of functional sensor labels manufactured from new and emerging printed electronic technology made from Thin Film’s read/write printed memory and program logic.
When used with Bemis packaging, the range of ‘intelligent’ labels will monitor and record key physical properties and environmental data in packaged perishable products.
Advantech drives innovation at ASEAN Connect 2026
The ASEAN Connect Conference brought together industry leaders to explore Edge AI, foster...
Australia sets path with National Semiconductor Roadmap
The Semiconductor Sector Service Bureau is leading the development of Australia's National...
Electronex 2026 to bring electronics innovation to Sydney
Electronex 2026 will return to Sydney's Rosehill Gardens in June, with over 100 electronics...
