Sensor labels signing
Bemis has signed a joint development agreement with Thin Film Electronics ASA to develop a Bemis intelligent packaging platform.
The agreement will accelerate the commercial development of functional sensor labels manufactured from new and emerging printed electronic technology made from Thin Film’s read/write printed memory and program logic.
When used with Bemis packaging, the range of ‘intelligent’ labels will monitor and record key physical properties and environmental data in packaged perishable products.
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