Sensor labels signing
Bemis has signed a joint development agreement with Thin Film Electronics ASA to develop a Bemis intelligent packaging platform.
The agreement will accelerate the commercial development of functional sensor labels manufactured from new and emerging printed electronic technology made from Thin Film’s read/write printed memory and program logic.
When used with Bemis packaging, the range of ‘intelligent’ labels will monitor and record key physical properties and environmental data in packaged perishable products.
Electronex expo returns to Sydney in 2026
Following the success of Melbourne's Electronex expo, the launch of Electronex 2026 in Sydney...
Electronex Sydney a major success
More than 1000 trade visitors and delegates have attended the Electronics Design & Assembly...
Gartner: Global AI chips revenue to grow 33% in 2024
Gartner has forecast that the revenue from AI semiconductors globally will total $71 billion in...
