Advantech SOM-5991 COM Express Basic Module

Click2Contact

Advantech’s SOM-5991 COM Express Basic Module, designed around the Intel Xeon processor D-1500 family, is powered by a server-grade processor that boasts up to 16-core scalability.

The module provides high bandwidth interfaces for data transmission-reception within a basic form factor of 125 x 95 mm with a Type 6 compliant pin-out. The high computing capability and low thermal design power deliver good power efficiency and make it suitable for microservers, networking and cloud storage.

The device incorporates two 10GBase-KR interfaces, which helps fulfil the ever-increasing service application demands in the area of COM Express. Users can take advantage of the native 10GBase-KR interfaces to design in 10GbE carrier boards. Moreover, PCIe x16 and 8 PCIe x1 support non-transparent bridging (NTB), which allows redundancy via PCIe.

The product has four screw holes near the CPU. The thermal module is attached to the CPU using the design of balanced torque. The COM Express adds a backplane to increase rigidity like single board, so the thermal module makes tight contact with the CPU and no board bending occurs. This results in efficient heat dissipation with high computing performance.

The development board was created especially for server-grade applications. To implement the remote management user scenario, a BMC controller is integrated on the carrier board. It also supports graphics with a VGA interface, KVM redirection, storage redirection and IPMI2.0/1.1 though a dedicated NIC (network interface controller) or shared NIC, SOL (serial-over-LAN), remote system BIOS update, etc.

For more information, click here.