STMicroelectronics ST8500 and S2-LP G3-PLC Hybrid certified chipset

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STMicroelectronics’ ST8500 and S2-LP chipset has become certified according to the G3-PLC Hybrid communication standard that defines seamless connectivity over powerline and wireless media.

The G3-PLC Hybrid specification allows smart-grid, smart-city, industrial and IoT equipment to select the best available wireless or powerline channel at any time, automatically and dynamically, according to network conditions. This enables good coverage and scalability, while also allowing cost-efficient system operation and enabling new use cases. The ST8500 Hybrid chipset is claimed to be the first to complete the latest G3-PLC certification scheme, published in March 2021, which incorporates the Hybrid profile tests.

The certified chipset combines the ST8500 programmable multi-protocol powerline communication system-on-chip (SoC) and STLD1 line driver with the company’s S2-LP ultralow-power sub-GHz radio transceiver. The SoC’s programmability enables a software-defined implementation capable of supporting a broad portfolio of powerline protocol stacks, in worldwide frequency bands such as CENELEC and FCC.

The powerline communication SoC platform is widely used in smart-metering smart industrial and infrastructure applications. The G3-PLC Hybrid turnkey solution has been used by key stakeholders in the smart-grid market; moreover, ST’s hardware and firmware solution has been selected to power the official G3-PLC Alliance RF certification-testing equipment.

The ST8500 SoC is packaged as a 7 x 7x 1 mm QFN56. The STLD1 and S2-LP are each packaged as 4 x 4 x 1 mm QFN24.

For more information: https://www.st.com/en/interfaces-and-transceivers.html.