Faster FeRAM on the way
Epson is developing a ferroelectric material for ferroelectric random-access memory (FeRAM), a next generation type of memory. The new material has been tentatively named PZTN.
To create the material, Epson has added niobium in place of some of the titanium in lead zirconate titanate (PZT), a candidate for use in FeRAM material. Using an original technique, the company has been able to introduce niobium in 20 to 30 times the quantity that was previously practically possible.
As a result, Epson has been able to overcome the oxygen deficit that had caused problems with FeRAM.
The company is now proceeding with technical testing of the FeRAM-based electronic devices using the PZTN material. Potential applications may include IC cards, mobile phones and as a semiconductor memory substitute.
Nanoscale pixels to advance augmented reality eyewear
Physicists have developed extremely small pixels that can be used in compact AR glasses, using...
Novel semiconductor shows superconducting promise
Researchers from The University of Queensland have demonstrated superconductivity in...
Light-controlled ferroelectrics for future electronics
Researchers have discovered a way to manipulate the properties of ferroelectric materials quickly...


