Lierda's low-power Bluetooth module uses an ST MCU

STMicroelectronics Pty Ltd

Friday, 16 July, 2021

Lierda's low-power Bluetooth module uses an ST MCU

Semiconductor company STMicroelectronics has announced that a new low-power Bluetooth module from Lierda Science & Technology Group, a hi-tech enterprise that provides IoT system and smart product solutions in China, uses an ST STM32WB55 Bluetooth LE (BLE) microcontroller (MCU).

With its stamp-type format, Lierda’s LSD1BT-STWB5500 module is highly integrated yet robustly resistant to interference. It is already Bluetooth LE certified, allowing users to better manage their time to market. The STM32WB MCU inside the module supports multiple protocols (including BLE 5.2, Zigbee 3.0 and Thread) with either dynamic or static concurrency mode.

Additional benefits of the Bluetooth module that simplify design for users and enhance safety include:

  • a high-performance crystal oscillator;
  • 1 MB Flash/256 KB RAM;
  • ultralow-power dual-core 64 MHz Arm Cortex-M4 and 32 MHz Cortex-M0+ MCU;
  • support for 44 GPIOs for expanded use;
  • an integrated balun that simplifies RF hardware design, development and production;
  • a space-saving 22 x 19 mm footprint.

“In today’s smart home appliances, smart industry, smart consumption, IoT and other industries, there is an increasing demand for MCUs that support multiple wireless protocols,” said Alex Yu, General Manager of Lierda ST Business Department. “The new low-power Bluetooth module developed by Lierda, an ST Authorized Partner, is based on ST’s latest STM32WB55 MCU platform.

“To maximise its high integration, high performance, low power consumption and other characteristics, the module supports multiple wireless protocols and fingerprint recognition algorithms and supports customer secondary development. Superior RF performance helps customers greatly shorten the design cycle.”

“Bluetooth and other 2.4 GHz protocols require expertise at both the hardware and software levels,” added Arnaud Julienne, Vice President, Head of Marketing and Applications of MDG, IoT/AI Competence Center and Digital Marketing, Asia Pacific Region, STMicroelectronics.

“By overcoming the design complexity and easing the burden and cost of certifications, modules are becoming key enablers for companies to develop their wireless products and accelerate time to market. Collaboration with Lierda is therefore instrumental for ST to better serve our customers in the wireless area, giving them access to STM32 products and ecosystem.”

Image credit: ©Сake78 (3D & photo)

Please follow us and share on Twitter and Facebook. You can also subscribe for FREE to our weekly newsletter and bimonthly magazine.

Related News

Rockley unveils new chip for wearable health monitoring

Silicon photonics technology company Rockley Photonics has developed a micro-transfer-printed...

New colloidal synthesis method for alkaline earth chalcogenides

Researchers have developed a way to synthesise new materials that could lead to more sustainable...

NIST, Google partner to produce open-source chips for researchers

The National Institute of Standards and Technology and Google have partnered to make...

  • All content Copyright © 2022 Westwick-Farrow Pty Ltd