Front-end modules

Microsemi has released the LX5551 and LX5552 front-end modules for IEEE 802.11b/g/n applications in the 2.4–2.5 GHz frequency range.

Addressing small form factor requirements driven by portable devices featuring Wi-Fi connectivity, both modules are offered in a low-profile 3 x 3 mm 16-pin MLPQ package.

Each also features an integrated power amplifier, 50 Ω input and output matching, and single-pole-double-throw switch.

The LX5551 cuts board space by more than 30% compared with a discrete design.

The LX5552 integrates a low noise amplifier for improved system performance while saving nearly 50% of the board area.

Both devices ease RF design complexity by integrating multiple active components and external tuning passives.

Key features of the LX5551 include: 2.4–2.5 GHz operation; 50 Ω input and output matching; PA power out 18 dBm at antenna for 3% error vector magnitude; PA 27 dB orthogonal frequency division multiplexing power gain; PA temperature compensated output power detector with wide dynamic range; SPDT switch with low insertion loss and good isolation; low profile 16-pin RoHS-compliant micro leadframe quad (MLPQ) package.

Key features of the LX5552 include: 2.4–2.5 GHz operation; 50 Ω input and output matching; LNA noise figure of 2 dB including SPDT switch loss; PA power out 17 dBm at antenna for 3% EVM; PA 27 dB OFDM power gain; PA temperature compensated output power detector with wide dynamic range; SPDT switch with 0.6 dB insertion loss and good isolation; 16-pin RoHS-compliant MLPQ package.