ROHM’s VML0604 package (0.6 x 0.4 mm, t = 0.36 mm) is said to reduce board space by 50% compared with alternative offerings, making it suitable for smartphones and other devices requiring smaller, thinner form factors.
Low on-resistance is also said to contribute to greater performance and the increased miniaturisation of smartphones, wearable devices and more.
In recent years the consumer electronics market, including smartphones and wearable devices, has driven the trend towards greater compactness and functionality, increasing demand for smaller, thinner components. And for transistors in particular, in addition to technical challenges such as bonding stability and package processing accuracy, it has been especially difficult to decrease transistor size, resulting in higher on-resistances and a maximum voltage in the 20 V range. ROHM, however, was able to successfully reduce package size and on-resistance while improving voltage resistance up to 60 V.
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