The TDK FS1406 µPOL DC-DC power modules integrate a matching MOSFET, inductor and driver in a single semiconductor embedded in a substrate (SESUB) package, reducing the device’s form factor by up to 50% when compared with modules using a side-by-side integrated circuit and inductor. The modules feature an on-chip pulse-width-modulation (PWM) controller, integrated MOSFETs and incorporated inductors and capacitors, resulting in a regulator with high power density of 1 W/mm3.
The plug-and-play devices are suitable for industrial applications that require high power density, including network communications, servers and storage. The modules also support imaging, radars, security and other machines for the medical industry. Offering 15 W of output power in a 3.3 x 3.3 x 1.5 mm package, the compact point-of-load modules support a range of high-performance applications, including machine learning, artificial intelligence, big data, 5G cells and the Internet of Things (IoT).
Phone: 0011 886 2 2799 2096
Leankon LK1810101 and LK1810601 Wi-Fi antennas
Leankon has launched a line of Wi-Fi 7, Wi-Fi 6E and Bluetooth integrated antennas that deliver...
STMicroelectronics Stellar P3E automotive microcontroller
The Stellar P3E automotive microcontroller delivers flexible, real-time performance for safe,...
ADLINK Express-PTL COM module
The ADLINK Express-PTL COM module features advanced hybrid CPU architecture combined with 128 GB...

