TDK SESUB-PAN-T2541 Bluetooth 4.0 LE module

TDK has available an ultracompact Bluetooth low-energy module designed for the Bluetooth 4.0 low-energy (LE) specification (Bluetooth Smart). With its miniature footprint of 4.6 x 5.6 mm and slim insertion height of 1 mm, the SESUB-PAN-T2541 Bluetooth 4.0 LE module is designed for Bluetooth Smart devices. Due to its compact size, the module is suitable for use in wearable devices.

The module is based on TDK’s SESUB technology (semiconductor embedded in substrate). The Bluetooth IC die is embedded into the thin substrate and all the peripheral circuitry, including a quartz resonator, bandpass filter and capacitors, is integrated on top. As a result, the product is nearly 65% smaller than modules that employ discrete components.

The substrate layers optimally route all of the I/Os to a BGA on the module’s bottom surface, enabling designers to take advantage of the chip’s functionality. The module thus facilitates the hardware design process and allows easy implementation of Bluetooth connectivity simply by connecting it to a power supply and antenna.

The Bluetooth 4.0 LE specification aims at significantly reducing the power consumption of battery-powered wireless devices. The module cuts power consumption to about one quarter of that of classic Bluetooth devices. This makes the product suited for a wide range of wireless healthcare, sport, fitness, home entertainment and wearable devices, where minimal size, weight and power consumption are essential.