Vicor Power-on-Package modular current multipliers

Vicor has announced the introduction of Power-on-Package modular current multipliers (MCMs) for high-performance, high-current, CPU/GPU/ASIC (XPU) processors. By freeing up XPU socket pins and eliminating losses associated with delivery of current from the motherboard to the XPU, the product enables higher current delivery for maximum XPU performance.

Vicor’s MCMs fit within the XPU package to expand on the efficiency, density and bandwidth advantages of the company’s Factorized Power Architecture. MCMs mounted on the XPU substrate under the XPU package lid, or outside of it, are driven at a fraction of the XPU current from an external modular current driver (MCD). The MCD, located on the motherboard, drives MCMs and regulates the XPU voltage with high bandwidth and low noise.

With MCMs mounted directly to the XPU substrate, the XPU current delivered by the MCMs does not traverse the XPU socket. Because the MCD drives MCMs at a low current, power from the MCD can be efficiently routed to MCMs, reducing interconnect losses by 10 times — even though 90% of the XPU pins typically required for power delivery are reclaimed for expanded I/O functionality. Additional benefits include a simplified motherboard design and a reduction in the minimum bypass capacitance required to keep the XPU within its voltage limits.

The small (32 x 8 x 2.75 mm) package and low noise characteristics of the MCM make it suitable for co-packaging with noise-sensitive, high-performance ASICs, GPUs and CPUs. The operating temperature range is -40 to +125°C.