Vishay Intertechnology custom substrates with sidewall patterning

Vishay Intertechnology has added a sidewall patterning capability to its custom thin film substrate offering. This allows the company to increase design flexibility and density for miniaturisation in military, aerospace, medical and telecom equipment.

The Vishay Dale Resistors Electro-Films product line offers SDWP substrates that accommodate die attach or wire bonding on side walls as well as the top side. Side-patterned connections have low inductance and therefore operate well at high frequency. This makes the devices suitable for custom circuits in electromechanical or electro-optical applications, high-frequency circuits in RF applications and high-bit-rate transceivers.

The capability enables designers to provide continuity between the top and bottom of a die, connect wire bonds to the traces on the side of the die or make contact with the side of the die with a pin. It also allows designers to mount a die on the substrate and then position the substrate in an assembly standing up, with a wire bond placed on what has become the ‘top’ of the substrate. This allows for better integration with the optical elements of the design.

The substrates feature a plate thickness of ≤0.025″, a minimum line width and gap of ≥0.003″ and tight line width and gap tolerances down to ± 0.001″. The substrates are available in a variety of metals.