WiMAX chipsets

Fujitsu has announced a mobile WiMAX chipset optimised for mobile devices such as smart phones and PDAs.

The chipset includes a baseband LSI, MB86K22, an RF LSI, MB86K52 and a power management LSI, MB39C316.

These three devices are essential to produce a WiMAX module. The chipset was designed to fit in the 12 x 12 mm WiMAX module. The standby current will not exceed 0.5 mA.

The MB86K22 is a fully integrated baseband LSI built using 65 nm CMOS low-leakage process technology. The operating power has been reduced by 36% from the previous generation.

Power-gating shuts down the power supply in the unused blocks inside the device, so that the entire module consumes 0.5 mA.

The MB86K52 is built using CMOS process, which supports 2.3, 2.5 and 3.5 GHz, covering almost all the frequencies set by the WiMAX Forum.

This enables mobile WiMAX terminal manufacturers to introduce their devices globally. The device also supports MIMO and beamforming technology, which is essential for mobile WiMAX Wave 2.

The MB39C316 power management LSI eliminates all the complex and time-consuming power management requirements by adopting a once-cell battery.

This design minimises the number of external peripheral devices of a module. MB39C316 controls and manages the power schemes of a module at the system level, keeping the power consumption in every operation to the minimum.