Your guide to the latest IGBT chip technology
Supplied by Semikron Pty Ltd on Friday, 01 November, 2019
The generation 7 IGBT promises to significantly cut your system costs. It comes with a significantly lower forward voltage drop and delivers optimised switching performance. Thanks to roughly 25% smaller chips, higher nominal currents can fit into your existing power module packages.
Learn about how you can reduce your power losses and increase maximum output power and power density.
Learn about how you can reduce your power losses and increase maximum output power and power density.
Related White Papers
Your guide to high performance power module packaging
Examine the key attributes of power module packaging. Learn how to deliver your...
Next-gen simulation tools for high-speed digital design
Learn how simulation tools as part of a modern PI workflow can prevent your failure rate...
