Investigation into isolated failure mechanisms
Supplied by Semikron on Tuesday, 04 August, 2015
Considerable efforts have been made to predict the operational lifetime of classical IGBT power modules over the last few decades. Most of these investigations were based on end-of-life active power cycling tests. The analysis identified two dominant failure modes: solder fatigue and Al wire bond failure. However, the lifetime models derived from these accelerated tests could not discriminate between these failure modes. Recently, more reliable interconnection technologies were developed, and both failure modes can now be studied independently.
This white paper presents experimental results that show how the failure modes cannot be described within one common lifetime model.
Why touch technology won’t eliminate physical controls
What types of industrial human machine interface (HMI) designs and functionalities do...
Power electronic systems: the effects of humidity and condensation
Explore key design tips that you need to mitigate...
Next-gen simulation tools for high-speed digital design
Learn how simulation tools as part of a modern PI workflow can prevent your failure rate...
