Investigation into isolated failure mechanisms
Supplied by Semikron on Tuesday, 04 August, 2015
Considerable efforts have been made to predict the operational lifetime of classical IGBT power modules over the last few decades. Most of these investigations were based on end-of-life active power cycling tests. The analysis identified two dominant failure modes: solder fatigue and Al wire bond failure. However, the lifetime models derived from these accelerated tests could not discriminate between these failure modes. Recently, more reliable interconnection technologies were developed, and both failure modes can now be studied independently.
This white paper presents experimental results that show how the failure modes cannot be described within one common lifetime model.
Planning a scalable long-term wireless strategy
Operators in many markets are transitioning to 3G and 4G technologies, whilst other operators...
Comparing the incomparable: understanding and comparing IGBT module datasheets
This white paper explains the component parameters of IGBT modules, points out possible...
[White paper] Optimising high-density power design: modular vs discrete
Learn about modular and discrete high-density...
