Investigation into isolated failure mechanisms
Supplied by Semikron on Tuesday, 04 August, 2015
Considerable efforts have been made to predict the operational lifetime of classical IGBT power modules over the last few decades. Most of these investigations were based on end-of-life active power cycling tests. The analysis identified two dominant failure modes: solder fatigue and Al wire bond failure. However, the lifetime models derived from these accelerated tests could not discriminate between these failure modes. Recently, more reliable interconnection technologies were developed, and both failure modes can now be studied independently.
This white paper presents experimental results that show how the failure modes cannot be described within one common lifetime model.
Valuable insights on obsolescence from the aerospace and defence industry
Discover insights identified to meet the obsolescence challenges you face today. Examine...
Factorised Power Architecture — achieving high density and efficiency in board-mounted power
Solving today's high-current and high-density point-of-load (PoL) problems requires a...
The SiC revolution — reliable, efficient and cost-effective
Discover how to deliver the high efficiency and...
