Investigation into isolated failure mechanisms
Supplied by Semikron on Tuesday, 04 August, 2015
Considerable efforts have been made to predict the operational lifetime of classical IGBT power modules over the last few decades. Most of these investigations were based on end-of-life active power cycling tests. The analysis identified two dominant failure modes: solder fatigue and Al wire bond failure. However, the lifetime models derived from these accelerated tests could not discriminate between these failure modes. Recently, more reliable interconnection technologies were developed, and both failure modes can now be studied independently.
This white paper presents experimental results that show how the failure modes cannot be described within one common lifetime model.
Next-gen EPS: powering electronics & high-tech manufacturing at business speed
[White paper] Accelerate your Innovation and...
Industrial Bus and Network Standards
With the migration of ethernet TCP/IP to IPv6, ethernet appears to be poised to become the...
Digital printing for electronic enclosures & front panels
Learn about digital printing for electronic...
