Investigation into isolated failure mechanisms
Supplied by Semikron on Tuesday, 04 August, 2015
Considerable efforts have been made to predict the operational lifetime of classical IGBT power modules over the last few decades. Most of these investigations were based on end-of-life active power cycling tests. The analysis identified two dominant failure modes: solder fatigue and Al wire bond failure. However, the lifetime models derived from these accelerated tests could not discriminate between these failure modes. Recently, more reliable interconnection technologies were developed, and both failure modes can now be studied independently.
This white paper presents experimental results that show how the failure modes cannot be described within one common lifetime model.
How to unlock greater efficiency and cut costs in your operations
[eBook] The Hidden ERP Costs in Food &...
How to leverage the re-emergence of DC high-voltage distribution
Learn about three operational topologies, pertinent examples and techniques that can be...
Practical EMI control in a power component design space
Learn how to mitigate noise to a great extent by design, using equipment commonly available in...
