Semikron Danfoss thermal interface material

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Power module manufacturer Semikron Danfoss offers a range of modules with pre-applied thermal interface materials (TIM). A thermal interface material is a substance inserted between a heat-generating component and a heat-dissipating device, such as a heat sink, to improve thermal coupling by filling microscopic gaps and facilitating heat transfer. TIMs enhance heat dissipation, preventing overheating by replacing insulating air with conductive material.

In power electronics systems design, the thermal interface material (TIM) plays a crucial role in the end product. It is the main contributor to the complete thermal impedance between the power electronic chip and the heat sink.

Semikron Danfoss offers more than 30 million pre-printed modules, including thermal grease or phase change materials depending on customer requirements (eg, performance increase, reduced handling effort) and module type (with or without baseplate).

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