STMicroelectronics Modular Telematics Platform (MTP)

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The Modular Telematics Platform (MTP) from STMicroelectronics provides an open development environment for prototyping smart driving applications, including vehicle connectivity to back-end servers, road infrastructure and other vehicles. The MTP integrates a central processing module based on the Telemaco3P secure automotive telematics processor and a comprehensive set of automotive-connectivity devices both on the board and in plug-in modules, ensuring development flexibility and extensibility.

At the core of the MTP is ST’s Telemaco3P device, an automotive processor that includes a dedicated hardware security module to provide on-chip security. The Telemaco3P’s integrated automotive security module can be further enhanced with an optional onboard ST33 Secure Element. The product also integrates ST’s automotive-grade multi-constellation GNSS Teseo IC with dead-reckoning sensors.

In addition, the platform supports connecting automotive buses such as CAN, FlexRay and BroadR-Reach (100Base-T1) to the board directly, and optional Bluetooth low energy, Wi-Fi and LTE modules offer access to wireless networks. Designed for automotive telematics use cases including remote diagnostics and secure Electronic Control Unit (ECU) firmware over-the-air (FOTA) updating, the MTP includes extension connectors for V2X and precise positioning modules.