NXP LPC43S67-A70CM Cloud Connectivity Kit

NXP’s LPC43S67-A70CM Cloud Connectivity Kit enables the design engineer to build secure IoT applications with AES encryption, NFC, Wi-Fi and a host of sensing technologies, driven by powerful, multicore ARM processing capabilities.

The kit offers a high-performance, dual-core ARM Cortex processor along with IC-enabled security and add-on boards affording the designer a range of IoT features like NFC, AES128/192/256 encryption, Wi-Fi connectivity, ethernet, an accelerometer, a gyroscope, a temperature sensor and an LCD, making it a suitable platform for anyone experimenting with IoT or cloud-backed mobile applications.

Beyond the target hardware, which includes the LPCXpresso43S67 board with LPC43S67 dual-core (M4F and M0+) MCU and NXP A7001CM Secure Element, NTAG NDC plug-in card, LPC General Purpose Shield and IEEE 802.11b/g SD card, the kit is supported by NXP’s LPCXpresso IDE and ZentriOS — a complete connected product operating system available as a licensable software solution. The Zentri SDK can be easily combined with the rich editing and debugging capabilities of the LPCXpresso IDE by installation of a free plugin.

Debugging is simplified by LPCXpresso43S67’s onboard Link2 probe, which provides full source code debugging capability without the need for any additional hardware.