Lintek has enhanced its printed circuit manufacturing capabilities by developing Via in Pad technology around vacuum metallisation.
This will enable the formation of copper-filled microvias laser drilled down to copper capture pads on multilayer PCB stacks. The copper-filled vias will simplify the assembly of BGA devices down to 0.4 mm pitch and this capability will be a first for Australia. Another capability the company is developing is improving the aspect ratio of its vacuum metallisation process. Lintek currently offers an aspect ratio of 4.5:1 (substrate thickness: hole diameter) and hopes to soon commercialise 5:1.
The company received grant funding for this project through DMO under the PICIP (Priority Industry Capability Innovation Program). Lintek is also working with the team from ‘Enterprise Connect’ at DIIC (Defence Industry Innovation Centre) to take its business to the next level.
Phone: 02 6299 1988
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