Vishay ThermaSim 3.0 online thermal simulation tool

Vishay Intertechnology has introduced the latest version of its free ThermaSim online thermal simulation tool for power MOSFETs, microBUCK power ICs and DrMOS products: ThermaSim 3.0.

ThermaSim 3.0 has been enhanced with a number of key features such as temporal zooming of die temperature with respect to power and the ability to define more real-world conditions for increased simulation accuracy and design reliability, while simplifying the user experience.

ThermaSim is created using finite element analysis (FEA) techniques for increased accuracy. The free online tool is especially useful in high-current, high-temperature applications such as automotive, fixed telecom, desktop and laptop computer, and industrial systems. The latest version is also suitable for applications with tight design margins and those subject to transient conditions, including UIS (unclamped inductive switching) and automotive load dump.

ThermaSim helps designers reduce time to market by allowing detailed thermal simulations of Vishay Siliconix power MOSFETs, ICs and DrMOS products to be performed before prototyping. ThermaSim 3.0 allows users to easily upload power profile datasets in Excel, repeat power profile datasets as many times as needed, and exchange the simulation results and a copy of the full design with other users when desired. In addition, the tool offers component orientation on the PCB with a graphical display.