Molex Micro-Fit 3.0 interconnects

Molex’s Micro-Fit 3.0 interconnects offer users a low- to mid-range power-distribution solution with a high current in a small footprint. Based on a 3 mm centreline, the product is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions.

The product can be purchased in pure tin or one of two thicknesses of select gold. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilise positive-lock features to prevent accidental disconnects.

The interconnects are UL recognised, CSA approved and TUV licensed. All components are lead-free, RoHS-compliant, halogen-free and glow-wire compatible.