Your essential guide to thermal paste application

Supplied by Semikron Pty Ltd on Monday, 09 July, 2018


This extensive paper describes the application of thermal paste (grease) as a thermal interface material between power semiconductor modules and heatsinks.

Learn how to best eliminate air gaps or spaces from your interface areas in order to maximise heat transfer.

Related White Papers

A breakthrough in AC front end power factor correction

Power Factor Corrected AC rectification has been addressed in a variety of ways over the...

Your guide to building a test system — switching and multiplexing

Understand the fundamentals of switching and multiplexing to build a smarter test system...

How to solve SWaP-C challenges with 270 V input applications

Defence applications with 270 VDC input must meet stringent EMI, environmental and power-related...


  • All content Copyright © 2018 Westwick-Farrow Pty Ltd