Your essential guide to thermal paste application

Supplied by Semikron Pty Ltd on Monday, 09 July, 2018

This extensive paper describes the application of thermal paste (grease) as a thermal interface material between power semiconductor modules and heatsinks.

Learn how to best eliminate air gaps or spaces from your interface areas in order to maximise heat transfer.

Related White Papers

Build high-performance power systems quickly and easily

A new line of AC-DC front-end components allows the Power Component Design Methodology to be...

[White paper] COM-HPC Mini — a game changer in the electronics space

Learn how the COM-HPD mini module is set to...

Power your microprocessor directly from 48 V

This novel solution enables high voltage low current to be distributed throughout a system,...

Content from other channels on our network

Government announces $1.1bn for cleaner fuel production

ABB Robotics invests in vision AI company

Green Gravity and Wollongong City sign MOU for clean energy innovation

Haigh's Chocolates opens new SA facility

Boral trials concrete with aggregates recarbonated via carbon capture

Jemena chooses BT Command to modernise Aust control rooms

Critical comms users on stage at Comms Connect next month

1900 MHz 5G radio network deployed on Deutsche Bahn test track

Tait Communications completes its takeover of Vital

Hytera continues to use Motorola's trade secrets, court finds

The art of seamless human-machine partnerships in the age of agentic AI

Pegasystems adds AI to payment investigations tool

DigiCert acquires Valimail to boost email security

Akamai adds secure browser to ZTNA portfolio

Excite Cyber makes cybersecurity predictions for 2026

All content Copyright © 2025 Westwick-Farrow Pty Ltd