Your essential guide to thermal paste application

Supplied by Semikron Pty Ltd on Monday, 09 July, 2018

This extensive paper describes the application of thermal paste (grease) as a thermal interface material between power semiconductor modules and heatsinks.

Learn how to best eliminate air gaps or spaces from your interface areas in order to maximise heat transfer.

Related White Papers

[White paper] Optimising high-density power design: modular vs discrete

Learn about modular and discrete high-density...

Powering the 12V-to-48V transition with bidirectional bridge converters

[White paper] Efficient 12V/48V DC Power...

[White paper] COM-HPC Mini — a game changer in the electronics space

Learn how the COM-HPD mini module is set to...

Content from other channels on our network

Second electrical offence leads to $43K penalty

Siemens expands Qld circuit-breaker facility

Applications open for Qld electrical apprenticeships

Sweden's Echandia supplies battery system to Tasmanian shipbuilder

GENERAL Australia announces new leader

Motorola Solutions expands emergency call translation with AI

ACMA consulting on licensing arrangements for 1800 MHz rail services

Frequentis takes majority ownership of Nemergent

DroneShield marks global manufacturing milestone in Europe

Motorola Solutions expanding Assist AI globally

Solving the human oversight problem in AI

Commvault to offer cyber resilience solutions on Azure

DigiCert extending PKI to confidential computing

Neoclouds set to capture 20% of AI cloud market by 2030

PagerDuty appoints Ingram Micro as Australian reseller

All content Copyright © 2026 Westwick-Farrow Pty Ltd