Your essential guide to thermal paste application

Supplied by Semikron Pty Ltd on Monday, 09 July, 2018


This extensive paper describes the application of thermal paste (grease) as a thermal interface material between power semiconductor modules and heatsinks.

Learn how to best eliminate air gaps or spaces from your interface areas in order to maximise heat transfer.

Related White Papers

The SiC revolution — reliable, efficient and cost-effective

Discover how to deliver the high efficiency and...

Thermal management — the key to extending device lifetime

Electronic components often generate significant amounts of heat while in use. Failure to...

Eliminate intermediate energy storage in EV power architectures

Learn about the BCM converter’s function, operation and capabilities as compared to a...


  • All content Copyright © 2026 Westwick-Farrow Pty Ltd