Your essential guide to thermal paste application
Supplied by Semikron Pty Ltd on Monday, 09 July, 2018
This extensive paper describes the application of thermal paste (grease) as a thermal interface material between power semiconductor modules and heatsinks.
Learn how to best eliminate air gaps or spaces from your interface areas in order to maximise heat transfer.
Learn how to best eliminate air gaps or spaces from your interface areas in order to maximise heat transfer.
Related White Papers
How to design more power chains in less time
Power system engineers are increasingly under pressure to do more in less time. Introducing...
Solar technology — tools, tips and tricks of the trade
Photovoltaic systems require specific knowledge and specialist products. Download this...
How to effectively connect IGBT power modules in parallel
Learn about the causes that can be attributed to an asymmetrical current distribution....
