Electrolube HTCX_ZF non-silicone, zinc oxide-free thermal paste

Electrolube has launched a non-silicone heat transfer compound known as HTCX_ZF. The high-performance thermal management paste is an entirely zinc oxide (ZnO)-free version of the thermal product HTCX, with improved thermal conductivity, lower oil bleed and lower evaporation weight loss.

Designed for use as a thermal interface material, HTCX_ZF is suitable for applications where the use of zinc oxide is restricted and silicones are prohibited, such as offshore utilities. The RoHS-2 compliant thermal paste is also suitable for applications exposed to varying temperature and humidity conditions.

The stable, non-curing paste enables simple and efficient rework of components if needed. It is recommended where efficient thermal coupling of electrical and electronic components is required and between any surface where thermal conductivity and heat dissipation is important. It offers efficient thermal conductivity of 1.65 W/mK for a range of applications, remaining stable and keeping a low oil bleed percentage through a wide operating temperature range from -50 to +180°C and potentially higher.

The paste can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semiconductors, thermostats, power resistors, radiators and more. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40–60% of the interface, depending on the smoothness of the surfaces. This means that air, which has relatively poor thermal conductivity, will account for the balance of the interface. Only a small amount of paste is required to fill these spaces to increase the effective surface area for heat transfer. It is also easy to apply, with the best results achieved with a uniform, thin coat applied between mating surfaces.