Users to get up to speed

Samtec and Teraspeed Consulting Group have joined forces to bring to market the next generation of high-speed interconnects, flex circuits and sub system and to develop design tools to maximise users performance in end systems. Teraspeed is also providing training and supportservices.

The collaboration helps Samtec create next generation connector design and approach the entire connector interface including the printed circuit board around the connector, as part of the entire system. The systems approach helps the user optimise the connector performance out into the board.

Samtec's Q-Up system is still under testing, but the Rise-Up system is already in production and is capable of transmitting data in excess of 6.25 Gb/sec (double Xaui speeds) with 25 mm board spacings.

The new relationship has also resulting in a design support product that provides PCB reference designs for high-speed interconnects that can save design, development and validation resources.