Winmate's IB70 and IK70 P-Cap Open Frame Panel PC Series are available in screen sizes from 15″ to 23.8″. The panel PCs are tailored with the powerful data handling ability and peripheral support to fulfil the operational needs of smart retail and other IoT-related applications.
The new machine, named 'Gadi', will feature 3200 nodes and provide a tenfold increase in speed compared to the existing supercomputer.
The Raspberry Pi 4 Model B Computer is three times faster compared to its predecessor, the Raspberry Pi 3 B+.
The ARK-1000 series are lower power consumption, fanless embedded box PCs that offer sufficient storage and expansion capability for easy implementation.
iBASE's MPT-3000RP is a fanless embedded PC that has been developed especially for railway applications. The EN50155/EN45545-certified and IP67-rated system offers the water and shock resistance necessary for outdoor applications and fully meets IIoV (Intelligent Internet of Vehicle) requirements.
Scientists have launched a new project to develop a 'noise-cancelling headphone' for quantum computers, set to increase the stability of fragile quantum building blocks.
Crystal Group's RE1529 Rugged Embedded Computer is feature-rich, configurable and engineered with the latest commercial off-the-shelf (COTS) technologies.
With an anti-corrosion housing and a wide standard operating temperature range, the Winmate R20IB3S-RKA2ML meets MIL-STD-810F/G.
Archer Exploration has commenced its maiden quantum technology project — to build a carbon-based quantum computing device that operates at room temperature.
Extreme Engineering Solutions (X-ES) introduces the XPedite7683 — a secure, high-performance, 3U OpenVPX single-board computer based on the Intel Xeon D-1500 family of processors.
The conga-JC370 3.5″ single-board computers (SBCs), from congatec, are equipped with commercial-grade 8th Generation Intel Core i7 Mobile processors, codenamed Whiskey Lake.
The VPX6860 series features the 6th Generation Skylake Intel Xeon E3-1505M processor and CM236 PCH chipset for wide-ranging I/O support. Expanded memory performance comes with up to 32 GB of DDR4 ECC SODIMMs that are firmly attached to the board but removable for security or upgrades.
The Raspberry Pi Compute Module 3+ delivers the enhanced thermal performance and ease of use of Raspberry Pi 3 Model B+ in a smaller form factor, with a choice of memory variants suitable for a broad range of embedded applications.
MPL's PANEL18 is an 18″, fanless, rugged panel PC powered by Intel's Atom and Core processors.
The RE1014 is part of a range of rugged industrial computing products that have been engineered and tested to withstand challenging environments.