Renesas Electronics second-generation USB 3.0-SATA3 Bridge SoC
13 March, 2013Renesas Electronics has available its SuperSpeed Universal Serial Bus (USB 3.0) to Serial ATA (SATA) Revision 3 [Note] bridge SoC (system on chip, part number μPD720231) that enables the reduction of the total BOM significantly.
Maxim TINI integrated SoCs and codec range
01 February, 2012Maxim has released its TINI family of integrated SoCs and codecs for consumer applications.
Renesas SuperSpeed universal serial bus SATA3 bridge system-on-chip
08 November, 2011 byRenesas has released its SuperSpeed universal serial bus (USB 3.0) SATA3 bridge system-on-chip that enables data transfer between a USB 3.0 host system and a Serial ATA (SATA) device in external USB storage equipment.
Ampro ETX-PVR ETX computer-on-module
15 March, 2011 byAdlink has announced the Ampro ETX-PVR, its latest Extreme Rugged ETX computer-on-module.
Kontron ETXexpress-SC computer-on-module
14 January, 2011 byParallel to the launch of the second generation Intel Core processor family, Kontron has introduced the COM Express basic form factor ETXexpress-SC computer-on-module.
Here COMes the future!
22 November, 2010 byFive years on, the PCI Industrial Computer Manufacturers Group (PICMG) has now released a new revision of the COM.0 Computer-on-Module standard that responds to new functionalities that Intel, AMD and other manufacturers are investing in their upcoming processor families.
Kontron ETXexpress-AI computer-on-module
08 October, 2010 byCoinciding with the launch of the COM Express 2.0 specification by the PCI Industrial Manufacturers’ Group (PICMG), Kontron has released an additional version of the computer-on-module ETXexpress-AI, based on the COM Express Type 6 pinout definition.
RF Micro Devices ML2730 transceiver
14 May, 2010 byRF Micro Devices has introduced the ML2730, a single-chip fully integrated frequency shift keyed transceiver with integrated power amplifier and low-noise amplifier.
Polymer microneedles for blood extraction
09 March, 2010 byImec has made hollow, out-of-plane microneedles with a height of 1540 µm and an aspect ratio exceeding 100. The needles are made from a polymer (SU-8) and the process is repeatable.
3D microchips and super cooling coming
24 February, 2010A technology for stacking several layers of microprocesssors, which is being developed at EPFL in collaboration with ETHZ and IBM Research, could boost the performance of computer chips by a factor of 10.
Low power SoC
27 April, 2009 byNordic Semiconductor has launched what it claims is the world’s smallest and most highly integrated single chip 2.4 GHz ultra-low power wireless system-on-chip — the nRF24LE1.
Network appliance
17 April, 2009 byAdvantech has introduced the FWA-3240 1U network appliance, claimed to be the first featuring the Intel EP80579 integrated processor system-on-a-chip (SOC).
Data transfer at 60 GHz
18 February, 2009Rapid transfer of a high-definition movie from a PC to a mobile phone — plus a host of other media and data possibilities — is approaching reality.
Another company joins 3D research
01 August, 2008IMEC, Europe's nanoelectronics research institute, and Qualcomm, will collaborate to understand and devleop solutions for using 3D technologies in future wireless products.
UL certification granted for COMs
03 August, 2006Until recently, UL certificates that were primarily accepted in the US, Canada and in other parts of the world were mainly available for systems. Now, with the implementation of UL certification for computer-on-modules (COMs), Kontron now provides OEMs with more security in selecting appropriate COMs and simplifies the procedure for its own UL certification.
