Nordic Semiconductor nRF52833 multiprotocol system-on-chip
16 March, 2020Nordic Semiconductor's nRF52833 multiprotocol system-on-chip (SoC) features Bluetooth 5.1 direction finding capabilities and an expanded temperature range.
Dialog Semiconductor DA14531 SmartBond TINY system-on-chip
27 February, 2020The DA14531 SmartBond TINY, from Dialog Semiconductor, is a small and power-efficient Bluetooth 5.1 system-on-chip (SoC) expected to enable more classes of Internet of Things (IoT) devices, including the growing market for connected medical products.
World's smallest all-digital circuit created, scientists say
21 February, 2020The all-digital phase-locked loop — a critical clocking circuit that is used in virtually all digital applications — fits in an area measuring just 50 x 72 µm2.
Qorvo PAC5556 Power Application Controller
30 January, 2020Qorvo's PAC5556 Power Application Controller delivers intelligent power control with good power density in a compact footprint. It is suitable for controlling and powering next-generation smart energy AC-powered appliances, devices and equipment, and should help to bring such appliances to market quickly.
STMicroelectronics STM32WLE5 LoRa system-on-chip
10 January, 2020STMicroelectronics has released the STM32WLE5 LoRa system-on-chip (SoC) for connecting smart devices to the Internet of Things (IoT) using long-distance wireless connections.
Cryogenic chip could enable viable quantum computers
16 December, 2019Intel Labs has unveiled what is believed to be a first-of-its-kind cryogenic control chip, which should help speed up development of full-stack quantum computing systems.
STMicroelectronics STPay-Topaz system-on-chip (SoC) payment solution
18 October, 2019STMicroelectronics' STPay-Topaz system-on-chip (SoC) payment solution comes ready for embedding in smartcards, loaded with payment applications running on certified JavaCard platforms and meeting all required security and payment-scheme certifications.
YouTransactor YTSECPCI system-on-chip for mobile payment terminals
11 October, 2019STMicroelectronics and YouTransactor have developed the YTSECPCI — a PCI secure system-on-chip (SoC) for mobile payment terminals based on a general-purpose microcontroller for robust performance and low power.
Xilinx Zynq UltraScale+ multiprocessor system-on-chips
07 October, 2019Xilinx Zynq UltraScale+ multiprocessor system-on-chips (MPSoCs) combine a high-performance Arm-based multicore, multiprocessing system with ASIC-class programmable logic.
Contactless payment comes to smart watches
31 October, 2018STMicroelectronics has partnered with Fidesmo in the creation of a turnkey active solution for secure contactless payments on smart watches and other wearable technology.
Nordic Semiconductor nRF52840 multiprotocol system-on-chip
18 July, 2018The nRF52840 is a multiprotocol system-on-chip (SoC) that offers simultaneous Bluetooth 5 and Thread support.
STMicroelectronics STSAFE-J100 security-on-a-chip
04 June, 2018Focused on providing security for connected objects, the STSAFE-J100 gives the object an unalterable identity that can be authenticated; it also handles encrypted communications and provides secure storage. It is easily integrated in IoT (Internet of Things) devices like smart meters, data concentrators and utility gateways.
STMicroelectronics STM32WB wireless system-on-chip
27 February, 2018The STM32WB wireless system-on-chip (SoC) devices combine a fully featured Arm Cortex-M4-based microcontroller to run the main application as well as an Arm Cortex-M0+ core to offload the main processor and offer real-time operation on the Bluetooth Low Energy (BLE) 5 and IEEE 802.15.4 radio.
ON Semiconductor RSL10 system-on-chip
23 January, 2018ON Semiconductor's RSL10 multiprotocol system-on-chip (SoC) is designed to bring ultralow-power connectivity to Internet of Things (IoT) devices and high-performance wearables.
Renesas R-Car D3 system-on-chip for 3D clusters
10 November, 2017Renesas Electronics has announced its high-performance R-Car D3 automotive infotainment system system-on-chip (SoC), designed to expand the use of 3D graphics instrument clusters (3D clusters) that support 3D graphics displays in entry-class cars.
