Renesas R-Car D3 system-on-chip for 3D clusters

Friday, 10 November, 2017 | Supplied by: Renesas Electronics


Renesas Electronics has announced its high-performance R-Car D3 automotive infotainment system system-on-chip (SoC), designed to expand the use of 3D graphics instrument clusters (3D clusters) that support 3D graphics displays in entry-class cars. The SoC includes a high-performance 3D graphics core that enables a high-quality 3D display.

Leveraging the Power VR Series 8XE graphics core from Imagination Technologies, the R-Car D3 achieves approximately six times improved drawing performance compared to the existing 3D graphics R-Car D1 SoC. This allows system developers to re-use content created for high-end cars in entry-class cars. System designers who had previously been concerned about hardware graphics performance limitations can now create graphics content without concern or limitations.

The SoC adopts the ball grid array (BGA) package, which simplifies the use of PCBs. This allows system developers to create 3D clusters using low-cost, four-layer PCBs. The Renesas R-Car D3 reference boards also use four-layer PCBs, and Renesas provides the design data as reference data for system developers to simplify the design of their own systems.

The R-Car D3 uses open GL ES 3.1 for 3D graphics drawing, which enables scalability with third-generation R-Car devices. The automatic memory calibration function of the DDR SDRAM, which is standard in R-Car SoCs, eliminates the need for timing adjustment of data transfer with the SRAM and memory evaluation man-hours requirements. The product supports the ISO 26262 (ASIL-B) automotive functional safety standard and provides a functional safety support program for implementing safe driving support systems.

Online: www.renesas.com
Phone: 0011 813 6250 5500
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