Components

AAEON de next-TGU8 embedded single board computer

01 December, 2022 | Supplied by: AAEON Technology Inc.

The AAEON de next-TGU8 is powered by an 11th Generation Intel Core Processor and equipped with processing power of up to 4 cores, with 8 threads.


Researchers use Maxwell's demon to prepare a quantum bit

01 December, 2022

Researchers from UNSW Sydney have used a modern version of Maxwell's demon to demonstrate a 20x improvement in resetting a quantum bit to its '0' state.


Technique developed to prevent bipolar degradation in silicon carbide electronics

01 December, 2022

Researchers have developed a fault suppression technique called "proton implantation" that can prevent bipolar degradation in 4H-SiC semiconductor wafers.


Infineon General-Purpose MOSFETs for power conversion applications

23 November, 2022 | Supplied by: Mouser Electronics

The Infineon General-Purpose MOSFETs are designed to deliver flexibility, value and adaptability for a variety of applications.


Quectel YB0027AA 9-in-1 combination antenna

18 November, 2022 | Supplied by: Quectel

The 9-in-1 antenna can integrate a wide variety of antennas to achieve communication functions including 5G MIMO, 4G, GNSS and Wi-Fi/Bluetooth.


AAEON BOXER-6645-ADS Fanless Embedded Box PC with socket

16 November, 2022 | Supplied by: AAEON Technology Inc.

The BOXER-6645-ADS features up to eight 10 Gbps USB 3.2 Gen 2 slots, four LAN ports and four independent display outputs, making it suitable for traffic management control rooms.


Winmate M700DM9 7″ ARM A73 and A53 Rugged Android Tablet

16 November, 2022 | Supplied by: Backplane Systems Technology Pty Ltd

The Winmate M700DM9 7″ ARM A73 and A53 Rugged Android Tablet is made with direct optical bonding technology for sunlight readability with true-to-life colours.


Quectel RG500L-EU 5G NR module

15 November, 2022 | Supplied by: Quectel

Quectel Wireless Solutions has announced that its industrial-grade 5G NR module, RG500L-EU, has gained GCF certification for operating on global 5G NR networks.


Erbium atoms in silicon for future quantum networks

11 November, 2022

Researchers have embedded erbium atoms in crystalline silicon, creating ideal conditions for storing and passing on quantum information.


New nanowire fabrication technique developed for next-gen spintronics

10 November, 2022

A new fabrication technique for nanostructure-induced CoPt ferromagnetic nanowires with twinned single-crystals could be significant for future spintronic applications.


Avalue OFP-15W38 and OFP-21W38 open-frame multitouch panel PCs

08 November, 2022 | Supplied by: Avalue

The Avalue OFP-15W38 and OFP-21W38 open-frame multitouch panel PCs are designed to enable faster computing performance to meet the requirements of the IoT market.


Physicists design new type of universal quantum computer

03 November, 2022

Physicists have developed a new architecture for building universal quantum computers, which reduces the physical qubits needed to calculate complex mathematical problems.


Stretchable packaging developed to protect batteries from gas, moisture

03 November, 2022

Researchers from Japan have developed a stretchable packaging film that protects batteries from atmospheric moisture and gases, to enhance battery life.


Laird Connectivity BL5340 multi-protocol BLE modules

03 November, 2022 | Supplied by: Mouser Electronics

The BL5340 multi-core multi-protocol Bluetooth modules include a dual-core Arm Cortex-M33 microcontroller to support wireless connectivity and end applications.


Teledyne e2v quad core ARM Cortex-A72 LS1046-Space processor

03 November, 2022 | Supplied by: Teledyne e2v Asia Pacific Limited

Teledyne e2v's LS1046-Space processor targets compute-intensive space applications, including high-throughput satellites, data compression, AI and imaging.


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