Components

Phone chip under joint development

08 December, 2008

NTT Docomo, Renesas, Fujitsu and Sharp plan to jointly develop the SH-mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA/HSDPA/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards.


Stretching wires produces power

28 November, 2008

Researchers have developed a type of small-scale electric power generator able to produce alternating current through the cyclical stretching and releasing of zinc oxide wires encapsulated in a flexible plastic substrate with two ends bonded.


Taking the strain of silicon

28 November, 2008

University of Wisconsin-Madison engineers and physicists have developed a method of measuring how strain affects thin films of silicon that could lay the foundation for faster flexible electronics.


Taiwan chip designers count down trend

26 November, 2008

Taiwan, with the world’s second-largest chip design industry, has some companies that have countered a slump in the global economy by tapping emerging markets such as China.


Component partnership

14 November, 2008

Soanar is distributing WIMA products in Australia and New Zealand.


In-road safety warning system

11 November, 2008 | Supplied by: Inventis Technology Pty Ltd

PNE Electronics has released SafeZone, an in-pavement flashing warning beacon system that is radio controlled and battery powered.


High current remote management power switches

10 November, 2008 | Supplied by: Interworld Electronics and Computer Industries

The vertically mounted high current MPC-Series Managed Power Controllers allow secure power management of rack-mount equipment via IP, external modem or local terminal.


Controller area network (CAN)

10 November, 2008 | Supplied by: http://www.emlogic.com.au

Embedded Logic Solutions supplies a range of controller area network (CAN)-based solutions. Whether the user needs a plug-in card for the PC, a microcontroller module for temperature recording, a CANopen-based application, or just the right kind of cable, the company claims to cover the user's needs.


Phone chip under joint development

10 November, 2008

NTT Docomo, Renesas, Fujitsu and Sharp plan to jointly develop the SH-Mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA/HSDPA/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards.


900 MHz 3G HSPA module

09 October, 2008 | Supplied by: http://www.m2mconnectivity.com.au

The Sierra Wireless MC8792V embedded module for 900 MHz 3G/HSPA networks offers tri-band HSPA/UMTS (900, 1900, and 2100 MHz) and quad-band support for GSM/GPRS/EDGE networks to provide new and existing OEM customers the ability to expand their product offering for mobile networks rolling out 900 MHz 3G/HSPA.


Avago Technologies distributor appointed

08 October, 2008

Avago Technologies has appointed Richardson Electronics to distribute its wireless products in the Europe.


Light blurs data transfer

15 September, 2008

Combining ordinary electronics with light has been a potential way to create minimal computer circuits with super fast information transfer. Researchers at Umeå University in Sweden and the University of Maryland in the US are now showing that there is a limit.


Graphene discovery wins major award

08 September, 2008

Two physicists from The University of Manchester who discovered the world’s thinnest material have scooped a major award for their work.


RF and microwave laminate

07 September, 2008 | Supplied by: http://www.clarke.com.au

Taconic’s TLX range of laminates can be sheared, drilled, milled and plated using standard manufacturing methods for PTFE/woven fibreglass materials. The laminates are dimensionally stable and exhibit virtually no moisture absorption during fabrication.


Silicon back in the race for quantum computers

02 September, 2008

The odds that the quantum computer will be built of silicon have increased now that researchers from the Centre for Quantum Computer Technology (CQCT) have announced recently invented technology.


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