Laird Technologies Clarke & Severn Tflex XS400 thermal gap filler
The Laird Technologies Tflex XS400 series is the latest thermal pad in the thermal gap filler range, offering a compliant elastomer filler specifically designed to provide moderate thermal performance with a conductivity of 2.0 W/mK.
The soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.
Available in thicknesses from 0.50 to 5.0 mm, the material is naturally tacky for easy assembly and no adhesive coating is required.
Due to its TG liner, it is electrically insulating, stable from -40 to 160°C, and is certified to UL 94V0 flammability rating, complying with the limits of RoHS Directive 2002/95/EC and its subsequent amendments.
Phone: 02 9482 1944
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