Laird Technologies Clarke & Severn Tflex XS400 thermal gap filler
The Laird Technologies Tflex XS400 series is the latest thermal pad in the thermal gap filler range, offering a compliant elastomer filler specifically designed to provide moderate thermal performance with a conductivity of 2.0 W/mK.
The soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.
Available in thicknesses from 0.50 to 5.0 mm, the material is naturally tacky for easy assembly and no adhesive coating is required.
Due to its TG liner, it is electrically insulating, stable from -40 to 160°C, and is certified to UL 94V0 flammability rating, complying with the limits of RoHS Directive 2002/95/EC and its subsequent amendments.
Phone: 02 9482 1944
Backplane IBASE AGS104L IoT gateway edge computing system
The IBASE AGS104L IoT gateway edge computing system provides a fanless computing platform for...
ASMPT SIPLACE V assembly platform
The SIPLACE V assembly platform is designed to handle large and heavy high-performance BGAs,...
EXAIR Dual Hazardous Location Cabinet Cooler Systems
The Dual Hazardous Location Cabinet Cooler Systems prevent overheating of sensitive electronics...
Learn More
I am interested in Laird Technologies Clarke & Severn Tflex XS400 thermal gap filler.
Complete the form and a supplier representative will be in touch.
