Laird Technologies Tpcm 580SP series phase change material

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Laird Technologies has released its Tpcm 580SP series phase change material.

The series is the latest phase change material offered in the company’s thermal interface material product range. It is screen printable or stencilable with a thermal conductivity of 4.0 W/mK that provides an alternative to thermal grease.

The PCM pad contains a solvent that assists in processing, which allows wetting the surface. After drying, the solvent is moistureless to the touch and eliminates the mess associated with thermal grease. Once the solvent is removed, the material begins to soften and flow at temperatures around 45°C; minimising thermal contact resistance by filling in the microscopic irregularities of the components it touches.

Because the material softens but does not fully change states, it minimises migration (pump out) under thermal cycling from room temperature to chip device operating temperatures.

It is available in a 0.5 or 1.0 kg can for manual screen printing and large volume automatic operations and is suitable for a variety of applications including high-frequency microprocessors, notebook PCs, desktop PCs, computer servers, DC/DC converters, memory modules, cache chips, IGBTs and motor vehicle and optical electronics.