Automated solder application

EFD's SolderPlus dispensing system integrates three EFD products - EFD SolderPlus solder paste, a dispense valve, and an XYZ positioning platform - into a way that automates solder application in benchtop assemblies.

The paste is specially formulated for precise, trouble-free dispensing without clogging or separating. It is prepackaged in disposable syringes and is available in a range of alloys, including lead-free formulations. It is applied with an EFD auger or piston valve mounted on the Ultra TT tabletop automation system, which integrates precise dispensing control and accurate positioning into one platform.

Each system is configured by EFD's application specialists to deliver a low-cost automation solution tailored to each customer's specific requirements - without the risks and unknowns often associated with process integration.