Heat sinks approved

Saturday, 31 July, 2004


Molex has received approval for its CoolFin heat sink from AMD for the next generation 64 bit processor, the Athlon 64.

The company had to meet very strict thermal resistance and other design requirements for the approval.

The heat sink range features stamped fin technology where the fins are individually stamped to a specified geometry and linked together for stability. Stamped fin designs can be virtually any shape or thickness, offering optimal design flexibility.

Related Products

METCASE DATAMET wall mount enclosures

The METCASE DATAMET wall mount enclosures are suitable for indoor electronic instruments,...

Ditel Micra M Max digital panel meter

The Ditel Micra M Max digital panel meter is equipped with Webserver, Bluetooth and MQTT...

PDR Focused IR rework station

The PDF Focused IR rework station is an entry-level PCB rework station used for precision SMD and...


  • All content Copyright © 2026 Westwick-Farrow Pty Ltd