Heat sinks approved
Molex has received approval for its CoolFin heat sink from AMD for the next generation 64 bit processor, the Athlon 64.
The company had to meet very strict thermal resistance and other design requirements for the approval.
The heat sink range features stamped fin technology where the fins are individually stamped to a specified geometry and linked together for stability. Stamped fin designs can be virtually any shape or thickness, offering optimal design flexibility.
Emerson Branson Polaris ultrasonic welding platform
The Branson Polaris ultrasonic welding platform delivers a flexible and scalable approach to...
NAD Electronics CI modular series
The CI modular series from NAD Electronics includes the NAD CI S2 Single Zone Streamer, the NAD...
MB-Tech NC25 parts cleaning system
The MB-Tech NC25 is a parts cleaning system designed to address a range of contaminants affecting...

