Interflux Electronics LMPA-Q low melting point alloys
Interflux Electronics’ LMPA-Q range of low melting point alloys (LMPAs) is designed to allow users to use soldering temperatures that are lower than for traditional lead-free Sn(Ag)Cu (SAC) alloys and other LMPAs on the market. The range can be used in wave, selective and reflow soldering processes and is said to reduce soldering temperatures by up to 70°C.
The range is designed to help users: solder at temperatures between 190 and 250°C; solder up to five times faster with zero defects; reduce voiding below 10%; increase production line capacity; reduce their carbon footprint; avoid heat-related board and component failures; and eliminate dross formation (oxides).
The range is available in solder wire, paste and bar. It removes the need for nitrogen and provides good wetting.
Phone: 1800 444 344
Backplane IBASE AGS104L IoT gateway edge computing system
The IBASE AGS104L IoT gateway edge computing system provides a fanless computing platform for...
ASMPT SIPLACE V assembly platform
The SIPLACE V assembly platform is designed to handle large and heavy high-performance BGAs,...
EXAIR Dual Hazardous Location Cabinet Cooler Systems
The Dual Hazardous Location Cabinet Cooler Systems prevent overheating of sensitive electronics...
