Samtec BEC5 Edge Rate high-density card socket series

Samtec has expanded its range of high-speed edge card solutions to include a high-density socket featuring a bi-level mating design, two levels of contacts on a staggered 1 mm centreline, which creates a card-effective 0.5 mm pitch.

The Edge Rate high-density edge card socket (BEC5 series) is available with up to 140 I/Os in a 1.00 x 1.27 mm grid PCB pad layout (four rows of contacts). This system is suitable for high-speed applications benefiting from its rugged Edge Rate contacts which are designed for impedance control and reduced broadside coupling with increased durability and cycle life.

The 0.5 mm pitch high density socket accepts standard 1.60 mm and 2.40 mm thick cards. Additional features include weld tabs, alignment pins and lead-free solder charge terminations for easy board processing. Tin-lead solder charges, as well as alternative platings and pin counts, are also available.